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Analysis of thickness and interfacial thermal resistance of Au microheater on glass or polyimide substrate
Ho-Sung Kim, Woong-Jun Ko and Dong-Wook Oh
The 3ω method is widely used for measuring the thermal properties of a substrate or thin film on which a microheater is deposited. Recently, samples with non-formal shapes and has a thermal conductivity of 1 W/mK or below have been analyzed using the bidirectional 3ω method. In measuring the thermal conductivity of such samples, the measurement sensitivity and accuracy can be increased using a 3ω sensor fabricated on a low thermal conductivity substrate such as glass or polyimide. In this study, thermal characterization is conducted on a microheater deposited on glass and polyimide substrates for a 3ω sensor. The effects of the microheater thickness and the interfacial thermal resistance between the substrate and microheater, on the temperature amplitude and phase lag are analyzed. Results from analytic solutions considering the microheater thickness and the interfacial thermal resistance are compared with results from numerical analysis of two-dimensional conduction heat transfer and experiment.
Keywords: 3 omega method, bi-directional heat conduction, microheater, interfacial thermal conductance
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DOI: 10.32908/hthp.v50.1073